Europe advanced packaging market was valued at $3,029.1 million in 2021 and will grow by 8.9% annually over 2021-2031 owing to the rising demand for consumer electronics, the growing demand for high-end chips, and the cost reduction and improved efficiency brought by advancing packaging.
The Advanced Packaging industry in Europe is experiencing rapid growth in domestic and international markets due to growing consumer awareness levels. The rising applications of advanced technologies within the industry have also been a key factor in the growth of this market. Growing disposable income among consumers, increasing demand for premium products and changing lifestyles are driving the market growth.
The report also covers current competitive scenario and the predicted trend; and profiles key vendors including market leaders and important emerging players.
Advanced Semiconductor Engineering Inc., Amkor Technology, Inc., Brewer Science, Inc., Chipbond Technology Corporation, Intel Corporation, International Business Machines Corporation (IBM), Microchip Technology, Inc., Qualcomm Technologies, Inc., Renesas Electronics Corporation, Samsung Electronics Co., Ltd., STATS ChipPAC Pte. Ltd, SÜSS Microtec Se, Taiwan Semiconductor Manufacturing Company, Limited, Texas Instruments, Inc., Universal Instruments Corporation
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In-depth qualitative analyses include identification and investigation of the following aspects:
• Market Structure
• Growth Drivers
• Restraints and Challenges
• Emerging Product Trends & Market Opportunities
• Porter’s Fiver Forces
Based on Product Type, the Europe advanced packaging market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Active Packaging
• Smart and Intelligent Packaging
Based on Packaging Platform, the Europe advanced packaging market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Flip-Chip Ball Grid Array
• Flip Chip CSP
• Wafer Level CSP
• 2.5D/3D Integrated Circuit
• Fan Out Wafer Level Package (Fo-WLP)
• Embedded Die
• Fan In Wafer Level Package (Fi-WLP)
• Other Packaging Platforms
By End User, the Europe advanced packaging market is segmented into the following sub-markets with annual revenue ($ mn) for 2021-2031 included in each section.
• Consumer Electronics
• IT and Telecom
• Automotive and Transportation
• Industrial Sector
• Healthcare and Life Science
• Aerospace and Defense
• Other End Users
Geographically, the following national/local markets are fully investigated:
• Germany
• UK
• France
• Spain
• Italy
• Russia
• Rest of Europe (further segmented into Netherlands, Switzerland, Poland, Sweden, Belgium, Austria, Ireland, Norway, Denmark, and Finland)
For each key country, detailed analysis and data for annual revenue ($ mn) are available for 2021-2031. The breakdown of the regional market by country and split of key national markets by Product Type, Packaging Platform, and End User over the forecast years are also included.
1 Introduction 7
1.1 Industry Definition and Research Scope 7
1.1.1 Industry Definition 7
1.1.2 Research Scope 8
1.2 Research Methodology 11
1.2.1 Overview of Market Research Methodology 11
1.2.2 Market Assumption 12
1.2.3 Secondary Data 12
1.2.4 Primary Data 12
1.2.5 Data Filtration and Model Design 13
1.2.6 Market Size/Share Estimation 14
1.2.7 Research Limitations 15
1.3 Executive Summary 16
2 Market Overview and Dynamics 19
