Stratistics MRC, the Global Semiconductor Assembly and Test Services Market is accounted for $34.24 billion in 2022 and is expected to reach $52.85 billion by 2028 growing at a CAGR of 7.5% during the forecast period.
Semiconductor assembly and test services are part of semi conductor manufacturing process. Semiconductors are used by many modern consumer goods in daily uses, such as in cell phones, laptops, video cameras, televisions, washing machines, refrigerators, and LED bulbs. Testing services includes functional, physical, and electrical testing of the product that verifies the quality of the product. In this process, all the parts of the product are assembled together and will be tested to know its functioning and efficiency.
Increase in disposable revenue of people across the globe drastically fuels sales of consumer electronics devices such as TV, mobile phones, and tablets which boosts requirement for outsourced semiconductor assembly and test services. In addition, increase in implementation of smart phones considerably propels the market growth.
By geography, Asia Pacific is projected to have the highest CAGR over the forecast period, owing to Semiconductor Assembly and Test Services systems are widely used in the entertainment, gaming, and social industries and owing to factors such as demand for an improved presentation experience, a rising number of start-ups. As a result of the Semiconductor Assembly and Test Services craze, hundreds of millions of dollars have been invested in Asia’s gaming and social network industries. The internet is transforming the way that many people communicate, and demand for digital entertainment services has risen dramatically.
Some of the key players profiled in the Semiconductor Assembly and Test Services Market include NetEase, Inc., Roblox Corporation, ByteDance Ltd., Lilith Games, Nvidia Corporation, Nextech AR Solutions Inc., Facebook Reality Labs, DeFi Land and Audius, Tencent Holdings, Ltd, Accenture Plc, Sandbox, Infosys Ltd., Epic Games, Inc, Wilkins Avenue AR, Unity Technologies, Inc., Devden Creative Solutions Pvt. Ltd, Microsoft Corporation, GoMeta Inc., Antier Solutions Pvt. Ltd. and Meta Platforms, Inc.
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By Services:
- Testing Services
- Assembly Services
- Packaging Services
- Other Services
By Packaging Types:
- Multi Package
- Ball Grid Array
- Stacked Die
- Quad
- Dual
- Chip Scale Package
- Other Packaging Types
By Applications:
- Industrial
- Automotive Electronics
- Communications
- Consumer Electronics
- Computing
- Networking
- Telecommunication
- Aerospace
- Defense
- Healthcare
- Logistics
- Transportation
- Other Applications
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